Texture characterization of Cu interconnects with different Ta based sidewall diffusion barriers

Wilson, ChrisChrisWilsonZhao, ChaoChaoZhaoVolders, HennyHennyVoldersZhao, LarryLarryZhaoCroes, KristofKristofCroesTokei, ZsoltZsoltTokeiBeyer, GeraldGeraldBeyer2021-10-192021-10-192010https://imec-publications.be/handle/20.500.12860/18360Texture characterization of Cu interconnects with different Ta based sidewall diffusion barriersOral presentation