Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor Designs

Agnesina, AnthonyAnthonyAgnesinaBrunion, MoritzMoritzBrunionKim, JinwooJinwooKimGarcia-Ortiz, AlbertoAlbertoGarcia-OrtizMilojevic, DragomirDragomirMilojevicCatthoor, FranckyFranckyCatthoorPerumkunnil, ManuManuPerumkunnilLim, Sung KyuSung KyuLim2022-03-302021-11-022022-03-232022-03-3020211533-4678WOS:000701418600006https://imec-publications.be/handle/20.500.12860/37447Power, Performance, Area and Cost Analysis of Memory-on-Logic Face-to-Face Bonded 3D Processor DesignsProceedings paper10.1109/ISLPED52811.2021.9502475978-1-6654-3922-0WOS:000701418600006