In-line metrology for characterization and control of extreme wafer thinning of bonded wafers

Liebens, MaartenMaartenLiebensJourdain, AnneAnneJourdainDe Vos, JoeriJoeriDe VosVandeweyer, TomTomVandeweyerMiller, AndyAndyMillerBeyne, EricEricBeyneLi, ShifangShifangLiBast, G.G.BastStoerring, MoritzMoritzStoerringHiebert, S.S.HiebertCross, AndrewAndrewCross2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28825In-line metrology for characterization and control of extreme wafer thinning of bonded wafersProceedings paperhttp://ieeexplore.ieee.org/document/7969255/