Cleaning the high aspect ratio STI structures for advanced logic devices by implementation of a surface modification drying technique

Sebaai, FaridFaridSebaaiVereecke, GuyGuyVereeckeXu, XiuMeiXiuMeiXuBaudot, SylvainSylvainBaudotAmemiya, FumihiroFumihiroAmemiyaKomori, KanaKanaKomoriHolsteyns, FrankFrankHolsteyns2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/31754Cleaning the high aspect ratio STI structures for advanced logic devices by implementation of a surface modification drying techniqueMeeting abstracthttps://www.scientific.net/SSP.282.190