Improved PBTI reliability in junction-less nFETs fabricated at low thermal budget for 3D sequential integration

Wu, ZhichengZhichengWuFranco, JacopoJacopoFrancoVandooren, AnneAnneVandoorenKaczer, BenBenKaczerRoussel, PhilippePhilippeRousselRzepa, GerhardGerhardRzepaLinten, DimitriDimitriLintenGroeseneken, GuidoGuidoGroeseneken2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/32296Improved PBTI reliability in junction-less nFETs fabricated at low thermal budget for 3D sequential integrationProceedings paperhttps://ieeexplore.ieee.org/document/8727075