Seed-less copper electrochemical deposition on barrier materials as a replacement/enhancement for PVD Cu seed layers in HAR TSVs

Armini, SilviaSilviaArminiPhilipsen, HaroldHaroldPhilipsenEl-Mekki, ZaidZaidEl-MekkiRedolfi, AugustoAugustoRedolfiVan Ammel, AnnemieAnnemieVan AmmelRadisic, AlexAlexRadisicNagar, MagiMagiNagarRuythooren, WouterWouterRuythooren2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/16664Seed-less copper electrochemical deposition on barrier materials as a replacement/enhancement for PVD Cu seed layers in HAR TSVsMeeting abstract