Wafer to wafer bonding using CuSn microbumps for GaN-LED substrate transfer process

Pham, NgaNgaPhamSoussan, PhilippePhilippeSoussanPeng, LanLanPengRosmeulen, MaartenMaartenRosmeulenSabuncuoglu Tezcan, DenizDenizSabuncuoglu Tezcan2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/24383Wafer to wafer bonding using CuSn microbumps for GaN-LED substrate transfer processProceedings paper