Teerlinck, IvoIvoTeerlinckSchmidt, HaraldHaraldSchmidtRotondaro, AntonioAntonioRotondaroHurd, TraceTraceHurdMouche, LaurentLaurentMoucheMertens, PaulPaulMertensMeuris, MarcMarcMeurisHeyns, MarcMarcHeynsVanhaeren, DanielleDanielleVanhaerenVandervorst, WilfriedWilfriedVandervorst2021-09-292021-09-291996https://imec-publications.be/handle/20.500.12860/1529Impact of the electrochemical properties of silicon wafer surfaces on copper outplating from HF solutionsProceedings paper