Enabling pre-sssembly process of 3D wafers with high topography at the backside

Podpod, ArnitaArnitaPodpodDemeurisse, CarolineCarolineDemeurisseInoue, FumihiroFumihiroInoueDuval, FabriceFabriceDuvalVisker, JakobJakobViskerDe Vos, JoeriJoeriDe VosRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyne2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25766Enabling pre-sssembly process of 3D wafers with high topography at the backsideProceedings paper