Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages,

Vandevelde, BartBartVandeveldeGonzalez, MarioMarioGonzalezLimaye, PareshPareshLimayeRatchev, PetarPetarRatchevBeyne, EricEricBeyne2021-10-162021-10-162007https://imec-publications.be/handle/20.500.12860/13130Thermal cycling reliability of SnAgCu and SnPb solder joints: a comparison for several IC-packages,Journal article