Demonstration of ultra-thin Si grinding process controlled by in-situ non-contact gauge for 3D stacked IC (3D-SIC)

Zhao, MingMingZhaoVerbinnen, GreetGreetVerbinnenYoshida, ShinjiShinjiYoshidaHayakawa, SusumuSusumuHayakawaTabuchi, TomotakaTomotakaTabuchiJourdain, AnneAnneJourdainBeyne, EricEricBeyneSwinnen, BartBartSwinnenLeunissen, PeterPeterLeunissen2021-10-192021-10-192010https://imec-publications.be/handle/20.500.12860/18427Demonstration of ultra-thin Si grinding process controlled by in-situ non-contact gauge for 3D stacked IC (3D-SIC)Proceedings paper