Guo, WeiWeiGuoChoi, MunkangMunkangChoiRouhi Najaf Abadi, AlirezaAlirezaRouhi Najaf AbadiMoroz, VictorVictorMorozVan der Plas, GeertGeertVan der PlasAbsil, PhilippePhilippeAbsilBeyne, EricEricBeyne2021-10-222021-10-222014https://imec-publications.be/handle/20.500.12860/23889Impact of 3D integration on 7nm high mobility channel devices operating in the ballistic regimeProceedings paper