Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copper

Siau, S.S.SiauVervaet, A.A.VervaetSchacht, E.E.SchachtCallewaert, K.K.CallewaertVan Calster, AndreAndreVan CalsterDegrande, S.S.Degrande2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/11197Chemical modification of buildup epoxy surfaces for altering the adhesion of electrochemically deposited copperJournal article