Tackling CMP challenges related to the integration of III-V materials for <10nm node applications

Teugels, LieveLieveTeugelsOng, PatrickPatrickOngWaldron, NiamhNiamhWaldronBoccardi, GuillaumeGuillaumeBoccardi2021-10-222021-10-222015https://imec-publications.be/handle/20.500.12860/25988Tackling CMP challenges related to the integration of III-V materials for <10nm node applicationsProceedings paper