Naeim, MohamedMohamedNaeimYang, HanqiHanqiYangChen, PinhongPinhongChenBao, RongRongBaoDekeyser, AntoineAntoineDekeyserSisto, GiulianoGiulianoSistoBrunion, MoritzMoritzBrunionChen, RongmeiRongmeiChenVan der Plas, GeertGeertVan der PlasBeyne, EricEricBeyneMilojevic, DragomirDragomirMilojevic2024-03-252023-08-102024-03-2520232164-0157WOS:001021364700038https://imec-publications.be/handle/20.500.12860/42309Design Enablement of 3-Dies Stacked 3D-ICs Using Fine-Pitch Hybrid-Bonding and TSVsProceedings paper10.1109/3DIC57175.2023.10155075979-8-3503-1137-2WOS:001021364700038