Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysis

Proost, JorisJorisProostLi, HuaHuaLiBrijs, BertBertBrijsWitvrouw, AnnAnnWitvrouwMaex, KarenKarenMaex2021-10-012021-10-011998https://imec-publications.be/handle/20.500.12860/2884Electromigration behaviour of 0.3 μm damascene vs. plasma-etched interconnects: a lifetime and drift analysisProceedings paper