Role of dielectric and barrier integrity in reliability of sub-100nm copper low-k interconnect

Tokei, ZsoltZsoltTokeiVan Aelst, JokeJokeVan AelstWaldfried, C.C.WaldfriedEscorcia, O.O.EscorciaRoussel, PhilippePhilippeRousselRichard, OlivierOlivierRichardTravaly, YoussefYoussefTravalyBeyer, GeraldGeraldBeyerMaex, KarenKarenMaex2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/11327Role of dielectric and barrier integrity in reliability of sub-100nm copper low-k interconnectProceedings paper