Lesniewska, AlicjaAlicjaLesniewskaRoussel, PhilippePhilippeRousselTierno, DavideDavideTiernoVega Gonzalez, VictorVictorVega Gonzalezvan der Veen, MarleenMarleenvan der VeenVerdonck, PatrickPatrickVerdonckJourdan, NicolasNicolasJourdanWilson, ChrisChrisWilsonTokei, ZsoltZsoltTokeiCroes, KristofKristofCroes2022-01-072021-11-022022-01-0720201541-7026WOS:000612717200119https://imec-publications.be/handle/20.500.12860/38210Dielectric Reliability Study of 21 nm Pitch Interconnects with Barrierless Ru FillProceedings paper978-1-7281-3199-3WOS:000612717200119K DIELECTRICS