Palacin, J.J.PalacinSalleras, M.M.SallerasMarco., S.S.Marco.Marty, A.A.MartyTasselli, J.J.TasselliVan Hoof, RitaRitaVan HoofBeyne, EricEricBeyneVendier, O.O.VendierCoella-Vera, A.A.Coella-Vera2021-10-142021-10-142002https://imec-publications.be/handle/20.500.12860/6685Dynamic compact thermal models for an ultra thin chip stacking technologyProceedings paper