Alternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assembly

Lofrano, MelinaMelinaLofranoCherman, VladimirVladimirChermanGonzalez, MarioMarioGonzalezBeyne, EricEricBeyne2021-10-242021-10-242017https://imec-publications.be/handle/20.500.12860/28848Alternative Cu pillar bumps design to reduce thermomechanical stress induced during flip chip assemblyProceedings paperhttp://ieeexplore.ieee.org/document/7926236/