Optimizing Au and In micro-bumping for 3D chip stacking

Zhang, WenqiWenqiZhangMatin, AbdulAbdulMatinRuythooren, WouterWouterRuythoorenBeyne, EricEricBeyne2021-10-172021-10-172008https://imec-publications.be/handle/20.500.12860/14835Optimizing Au and In micro-bumping for 3D chip stackingProceedings paper