Filling of 80nm trenches using a novel copper oxide reduction and reflow approach

Carbonell, LaureLaureCarbonellPalmans, RogerRogerPalmansTravaly, YoussefYoussefTravalyTokei, ZsoltZsoltTokeiJonas, Alain M.Alain M.JonasBrongersma, SywertSywertBrongersmaMaex, KarenKarenMaex2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/10176Filling of 80nm trenches using a novel copper oxide reduction and reflow approachProceedings paper