Smith, KenKenSmithHanaway, PeterPeterHanawayJolley, MikeMikeJolleyGleason, ReedReedGleasonStrid, EricEricStridDaenen, TomTomDaenenDupas, LucLucDupasKnuts, BrunoBrunoKnutsMarinissen, Erik JanErik JanMarinissenVan Dievel, MarcMarcVan Dievel2021-10-192021-10-192011-09https://imec-publications.be/handle/20.500.12860/19809Evaluation of TSV and micro-bump probing for wide I/O testingProceedings paper