Inoue, FumihiroFumihiroInouePhommahaxay, AlainAlainPhommahaxayPodpod, ArnitaArnitaPodpodSuhard, SamuelSamuelSuhardHoshino, HitoshiHitoshiHoshinoBerthold, MoellerMoellerBertholdSleeckx, ErikErikSleeckxRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33197Advanced dicing technologies for combination of wafer to wafer and collective die to wafer fusion bondingProceedings paperhttps://ieeexplore.ieee.org/document/8811039