Post dry-etch cleaning issues of an organic low-K dielectric

Lanckmans, FilipFilipLanckmansBaklanov, MikhaïlMikhaïlBaklanovAlaerts, CarineCarineAlaertsVanhaelemeersch, SergeSergeVanhaelemeerschMaex, KarenKarenMaex2021-10-062021-10-061999https://imec-publications.be/handle/20.500.12860/3606Post dry-etch cleaning issues of an organic low-K dielectricProceedings paper