Analysis of high-Q on-chip inductors realized by wafer level packaging techniques

Sun, XiaoXiaoSunCarchon, GeertGeertCarchonDe Raedt, WalterWalterDe RaedtBeyne, EricEricBeyne2021-10-152021-10-152003https://imec-publications.be/handle/20.500.12860/8195Analysis of high-Q on-chip inductors realized by wafer level packaging techniquesProceedings paper