Soper, A.A.SoperDe Wolf, IngridIngridDe WolfPozza, G.G.PozzaIgnat, M.M.IgnatParat, G.G.Parat2021-10-012021-10-011998https://imec-publications.be/handle/20.500.12860/2966Damage evolution and mechanical failure in flip-chip interconnectsProceedings paper