Test impact on the overall die-to-wafer 3D stacked IC cost

Taouil, MottaqiallahMottaqiallahTaouilHamdioui, SaidSaidHamdiouiBeenakker, KeesKeesBeenakkerMarinissen, Erik JanErik JanMarinissen2021-10-202021-10-202012-020923-8174https://imec-publications.be/handle/20.500.12860/21593Test impact on the overall die-to-wafer 3D stacked IC costJournal articlehttp://dx.doi.org/10.1007/s10836-011-5270-3