Limaye, PareshPareshLimayeVandevelde, BartBartVandeveldeLabie, RietRietLabieVandepitte, DirkDirkVandepitteVerlinden, BertBertVerlinden2021-10-172021-10-1720081521-3323https://imec-publications.be/handle/20.500.12860/14041Influence of intermetallic properties of lead-free flip chip solder jointsJournal article