Multi-visit TAMs to reduce the post-bond test length of 2.5D-SICs with a passive silicon interposer base

Chi, Chun-ChuanChun-ChuanChiMarinissen, Erik JanErik JanMarinissenGoel, Sandeep K.Sandeep K.GoelWu, Cheng-WenCheng-WenWu2021-10-192021-10-192011-11https://imec-publications.be/handle/20.500.12860/18678Multi-visit TAMs to reduce the post-bond test length of 2.5D-SICs with a passive silicon interposer baseProceedings paper