Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectrics

Vanstreels, KrisKrisVanstreelsKrishtab, MikhailMikhailKrishtabGarcia Gonzalez, LauraLauraGarcia GonzalezArmini, SilviaSilviaArmini2021-10-242021-10-2420170003-6951https://imec-publications.be/handle/20.500.12860/29793Impact of organic linking and terminal groups on the mechanical properties of self-assembly based low-k dielectricsJournal articlehttp://aip.scitation.org/doi/full/10.1063/1.4993088