Katti, GuruprasadGuruprasadKattiStucchi, MicheleMicheleStucchiVelenis, DimitriosDimitriosVelenisThangaraju, SarasvathiSarasvathiThangarajuDe Meyer, KristinKristinDe MeyerDehaene, WimWimDehaeneBeyne, EricEricBeyne2021-10-192021-10-1920110741-3106https://imec-publications.be/handle/20.500.12860/19163Technology assessment of through-silicon via by using C-V and C-t MeasurementsJournal article