Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder Stacking

Inoue, FumihiroFumihiroInoueDerakhshandeh, JaberJaberDerakhshandehGerets, CarineCarineGeretsBeyne, EricEricBeyne2022-01-312021-12-032022-01-312021naWOS:000720319500005https://imec-publications.be/handle/20.500.12860/38524Cobalt-Tin Intermetallic Compounds as Alternative Surface Finish for Low Temperature Die-to-Wafer Solder StackingProceedings paper978-4-9911911-0-7WOS:000720319500005