De Messemaeker, JokeJokeDe MessemaekerVarela Pedreira, OlallaOlallaVarela PedreiraVandevelde, BartBartVandeveldePhilipsen, HaroldHaroldPhilipsenDe Wolf, IngridIngridDe WolfBeyne, EricEricBeyneCroes, KristofKristofCroes2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/22212Impact of post-plating anneal and Through-Silicon Via dimensions on Cu pumpingProceedings paper