Van Dooren, SofieSofieVan DoorenVandevelde, BartBartVandeveldeBeyne, EricEricBeyneChristiaens, FilipFilipChristiaensCorlatan, D.D.Corlatan2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4819Parametric compact models for flip chip assembliesJournal article