Soulie, Jean-PhilippeJean-PhilippeSoulieSankaran, KiroubanandKiroubanandSankaranVan Troeye, BenoitBenoitVan TroeyeLesniewska, AlicjaAlicjaLesniewskaVarela Pedreira, OlallaOlallaVarela PedreiraOprins, HermanHermanOprinsDelie, GillesGillesDelieFleischmann, ClaudiaClaudiaFleischmannBoakes, LizzieLizzieBoakesRolin, CedricCedricRolinRagnarsson, Lars-AkeLars-AkeRagnarssonCroes, KristofKristofCroesPark, SeonghoSeonghoParkSwerts, JohanJohanSwertsPourtois, GeoffreyGeoffreyPourtoisTokei, ZsoltZsoltTokeiAdelmann, ChristophChristophAdelmann2024-11-042024-11-042024-11-070021-8979https://imec-publications.be/handle/20.500.12860/44736Journal article10.1063/5.0224027WOS:001346509900011copper interconnectinterconnectsmetallization processthin filmsalternative metals