Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)

Christiaens, WimWimChristiaensTorfs, TomTomTorfsHuwel, W.W.HuwelVanfleteren, JanJanVanfleteren2021-10-172021-10-172008-09https://imec-publications.be/handle/20.500.12860/13525Functionality and reliability testing of bendable ultrathin chip packages (UTCP's)Meeting abstract