Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boards

Fei, GuanghaiGuanghaiFeiNie, LeiLeiNieZhong, LipengLipengZhongShi, QiminQiminShiHu, KehuiKehuiHuParra-Cabrera, CesarCesarParra-CabreraOprins, HermanHermanOprinsAmeloot, RobRobAmelootYang, ShoufengShoufengYang2022-06-012022-05-212022-05-232022-06-012022-062352-4928WOS:000793291500004https://imec-publications.be/handle/20.500.12860/39862Photocurable resin-silica composites with low thermal expansion for 3D printing microfluidic components onto printed circuit boardsJournal article10.1016/j.mtcomm.2022.103482WOS:000793291500004POLYMER MATRIX COMPOSITESEPOXY-RESINSSUSPENSIONSDEVICESBEHAVIORFLOWSIZEPolymer-matrix composites (PMCs); Thermal properties; Surface analysis; Stereolithography 3D printing