Integration of ball lens in through-package via to enable photonic chip-to-board coupling

Mangal, NiveshNiveshMangalMissinne, JeroenJeroenMissinneVan Campenhout, JorisJorisVan CampenhoutVan Steenberge, GeertGeertVan SteenbergeSnyder, BradBradSnyder2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/31278Integration of ball lens in through-package via to enable photonic chip-to-board couplingProceedings paperhttps://ieeexplore.ieee.org/document/8429688/