Development and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnects

Van Besien, ElsElsVan BesienWang, CongCongWangVerdonck, PatrickPatrickVerdonckSingh, ArjunArjunSinghBarbarin, YohanYohanBarbarinSchaekers, MarcMarcSchaekersBaklanov, MikhaïlMikhaïlBaklanovVan Elshocht, SvenSvenVan Elshocht2021-10-212021-10-212013https://imec-publications.be/handle/20.500.12860/23222Development and evaluation of a-SiC:H films using a dimethylsilacyclopentane precursor as a low -k Cu capping layer in advanced interconnectsProceedings paperhttp://ieeexplore.ieee.org/xpl/articleDetails.jsp?tp=&arnumber=6615577&contentType=Conference+Publications