Bertheau, JulienJulienBertheauInoue, FumihiroFumihiroInouePhommahaxay, AlainAlainPhommahaxayPeng, LanLanPengIacovo, SerenaSerenaIacovoRassoul, NouredineNouredineRassoulSleeckx, ErikErikSleeckxRebibis, Kenneth JuneKenneth JuneRebibisMiller, AndyAndyMillerBeyer, GeraldGeraldBeyerBeyne, EricEricBeyneNakamura, AtsushiAtsushiNakamura2021-10-252021-10-252018https://imec-publications.be/handle/20.500.12860/30241Extreme thinned-wafer bonding using low temperature curable polyimide for advanced waferlevel integrationsProceedings paperhttps://ieeexplore.ieee.org/abstract/document/8429534