At-speed inter-die interconnect test in 2.5D- and 3D-SICs

Shibin, KonstantinKonstantinShibinChickermane, VivekVivekChickermaneKeller, BrionBrionKellerPapameletis, ChristosChristosPapameletisMarinissen, Erik JanErik JanMarinissen2021-10-222021-10-222015-10https://imec-publications.be/handle/20.500.12860/25900At-speed inter-die interconnect test in 2.5D- and 3D-SICsProceedings paperhttp://www.itctestweek.org/files/3DTest15Program.pdf