John, JoachimJoachimJohnDe Moor, PietPietDe MoorColin, ThierryThierryColinDe Kerckhove, AlexAlexDe KerckhoveBorgers, TomTomBorgersHooylaerts, PeterPeterHooylaertsDe Munck, KoenKoenDe MunckTezcan, DenizsDenizsTezcanVan Hoof, ChrisChrisVan Hoof2021-10-162021-10-162005-06https://imec-publications.be/handle/20.500.12860/10654Indium solder bump technology for ultra high density interconnects in hybrid image sensorsProceedings paper