Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon Vias

Huyghebaert, CedricCedricHuyghebaertVan Olmen, JanJanVan OlmenOkoro, ChukwudiChukwudiOkoroCoenen, JensJensCoenenJourdain, AnneAnneJourdainVan Cauwenberghe, MarcMarcVan CauwenbergheAgarwal, RahulRahulAgarwalPhommahaxay, AlainAlainPhommahaxayStucchi, MicheleMicheleStucchiSoussan, PhilippePhilippeSoussan2021-10-182021-10-182010https://imec-publications.be/handle/20.500.12860/17299Enabling 10μm pitch hybrid Cu-Cu IC stacking with Through Silicon ViasProceedings paper