Packaging and assembly challenges for 50G silicon photonics interposers

Snyder, BradBradSnyderMangal, NiveshNiveshMangalLepage, GuyGuyLepageBalakrishnan, SadhishkumarSadhishkumarBalakrishnanSun, XiaoXiaoSunPantano, NicolasNicolasPantanoRakowski, MichalMichalRakowskiBogaerts, LieveLieveBogaertsDe Heyn, PeterPeterDe HeynVerheyen, PeterPeterVerheyenMiller, AndyAndyMillerPantouvaki, MariannaMariannaPantouvakiAbsil, PhilippePhilippeAbsilVan Campenhout, JorisJorisVan Campenhout2021-10-262021-10-262018https://imec-publications.be/handle/20.500.12860/31822Packaging and assembly challenges for 50G silicon photonics interposersProceedings paperhttps://ieeexplore.ieee.org/document/8385876