New hybrid bonding approach for 3D stacking of ICs

Jourdain, AnneAnneJourdainSoussan, PhilippePhilippeSoussanSwinnen, BartBartSwinnenBeyne, EricEricBeyne2021-10-172021-10-172009-08https://imec-publications.be/handle/20.500.12860/15552New hybrid bonding approach for 3D stacking of ICsJournal articlehttp://oliveexpress.com/Olive/oliveexpress/ox/?href=Sample/2009/09/08&view=document