Single wafer cleaning and drying: particle removal via a non-contact, non-damaging megasonic clean followed by a high performance "Rotagoni" dry

Lauerhaas, JeffJeffLauerhaasMertens, PaulPaulMertensFyen, WimWimFyenKenis, KarineKarineKenisMeuris, MarcMarcMeurisNicolosi, T.T.NicolosiBran, M.M.BranFraser, B.B.FraserFranklin, C.C.FranklinWu, Y.Y.WuHeyns, MarcMarcHeyns2021-10-142021-10-142000https://imec-publications.be/handle/20.500.12860/4519Single wafer cleaning and drying: particle removal via a non-contact, non-damaging megasonic clean followed by a high performance "Rotagoni" dryProceedings paper