Balachandran, JayaprakashJayaprakashBalachandranBrebels, StevenStevenBrebelsCarchon, GeertGeertCarchonWebers, TomasTomasWebersDe Raedt, WalterWalterDe RaedtNauwelaers, BartBartNauwelaersBeyne, EricEricBeyne2021-10-162021-10-162005https://imec-publications.be/handle/20.500.12860/10055Package level interconnect optionsProceedings paper