Thermal management and processing optimization for 3D multi-layer stacked IC's

Lofrano, MelinaMelinaLofranoCherman, VladimirVladimirChermanGerets, CarineCarineGeretsBex, PieterPieterBexBeyne, EricEricBeyne2021-10-272021-10-272019https://imec-publications.be/handle/20.500.12860/33467Thermal management and processing optimization for 3D multi-layer stacked IC'sProceedings paper