Design of test structures for the characterization of thermal-mechanical stress in 3D stacked IC

Minas, NikolaosNikolaosMinasVan der Plas, GeertGeertVan der PlasOprins, HermanHermanOprinsMercha, AbdelkarimAbdelkarimMerchaCherman, VladimirVladimirChermanTorregiani, CristinaCristinaTorregianiRakowski, MichalMichalRakowskiMarchal, PolPolMarchal2021-10-202021-10-2020120894-6507https://imec-publications.be/handle/20.500.12860/21147Design of test structures for the characterization of thermal-mechanical stress in 3D stacked ICJournal article